PCBA Processing Procedure and Key Precautions

• PCBA processing begins with generating process and coordination files from provided Gerber files and BOMs.
• Materials are prepared meticulously before production to ensure adherence to specifications.
• Staff must wear anti-static gloves, and proper organization of PCBA substrates is crucial to prevent damage.

PCBA Processing Flow

1. Creation of process files and SMT coordinate files based on customer’s data.
2. Verification of materials, order compilation, and PMC production plan confirmation.
3. Execution of SMT programming and initial board production for accuracy verification.
4. Utilization of SMT methods for laser-cut steel meshes creation.
5. Ensuring uniform and appropriate solder paste printing for consistency.
6. Component mounting using SMT placement machine with online AOI inspection.
7. Establishment of optimal reflow soldering furnace temperature curve for effective soldering.
8. IPQC inspection to meet processing technology requirements.
9. DIP plug-in process with wave soldering for connections.
10. Post-furnace processes including lead trimming, inspections, and surface cleaning.
11. Comprehensive QA testing to guarantee processing quality.

PCBA Processing Precautions

• Warehouse personnel should wear anti-static gloves and ground work surfaces during material distribution and IQC testing.
• Utilize anti-static work surfaces and containers for components and products storage.
• Repair any misalignment of plug-in components after the soldering process.
• Exercise caution to avoid excessive solder usage during PCBA soldering to prevent short circuits.
• Properly organize PCBA substrates and use electrostatic bags for stacking to prevent damage.