The PCBA processing workflow encompasses project evaluation. During product design, customers must prioritize manufacturability, confirm partnerships, sign contracts, procure materials, and conduct inspections and processing. In the following sections, I will outline the PCBA processing workflow and reliability testing.

1. PCBA processing workflow

1. The evaluation of PCBA projects is crucial; customers must focus on design for manufacturability, which is vital for maintaining quality control throughout the manufacturing process.

2. Confirm the partnership and finalize the contract. Following negotiations, both parties agree to collaborate and sign the contract.

3. The customer submits processing information. Once the product design is complete, the customer provides the Gerber file, BOM list, and other engineering documents to the supplier. A dedicated technician from the supplier will review, confirm, and assess details related to stencil printing, surface mount technology, and through-hole processes.


4. Material procurement, inspection, and processing: Customers prepay a portion of the PCBA processing costs to the supplier, typically ranging from 30% to 100%, with an average of 70%. The remaining balance is settled before shipment or can be prepaid in full. Upon receiving payment, the supplier purchases components and organizes production according to the PMC plan once preparations are complete.

5. SMT assembly processing, DIP insertion processing, and inline production follow quality inspections after SMT, including reflow soldering, AOI inspection, and subsequent DIP insertion and wave soldering processes.

6. Quality inspection by the quality department: The quality department performs random checks on some products or conducts complete inspections, repairing any defective items found.

7. Packaging and shipping, along with after-sales service: All products are packaged and shipped following the completion of quality inspections. The standard packaging method is anti-static, but if customers have specific requirements, packaging will be tailored accordingly, and after-sales service will be monitored.

2. PCBA processing reliability tests

1. Aging: The PCBA board with functional OK tests is placed under controlled temperature and humidity conditions, subjected to repeated power cycling, simulated operational loads, etc., to assess stability over 24 to 72 hours of continuous operation. Due to the lengthy nature of aging tests, they are typically limited to sample testing, with overall yield rates determined by the pass rate of random inspections.

2. Vibration test: Many PCBA boards encounter issues like component detachment and pad cracking during transport. Vibration testing effectively simulates transportation conditions in the lab, revealing potential weaknesses in the welding process. This approach minimizes batch welding defects and enhances overall delivery yield. Professional motion simulation vibration workbenches are available on the market, costing around 5,000 yuan.

3. Surge impact test: While PCBA boards may function correctly under normal voltage, they can occasionally fail due to surges. Many circuit designs overlook the detrimental effects of instantaneous voltage or current spikes on the circuit. Therefore, conducting sampling surge impact experiments prior to mass production is essential.

4. Packaging test: This test is frequently neglected, leading to amusing situations where we invest significant effort into perfecting the PCBA board only to encounter failures during the final packaging and transportation stages. Factories should simulate the packaging configuration of the PCBA board to conduct appropriate drop tests.

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