Purpose
Standardizing the furnace temperature curve setting procedure is crucial to ensure the quality of Surface Mount Technology (SMT) products.
Scope
This procedure is applicable for setting the temperature curve of lead solder paste used by SMT manufacturers.
Responsibilities
- Engineering Department: Responsible for configuring the furnace temperature following this procedure.
- Quality Department: Responsible for verifying the furnace temperature settings as per this procedure.
Assignment Content
When setting the furnace temperature for SMT products, it is essential to:
- Identify the heat capacity category based on the product being produced and test if it meets the curve requirements.
- Ensure the temperature aligns with the reflow profile of all SMD devices to prevent component damage.
- Consider factors such as layout, packaging, PCB thickness, and material to optimize the reflow process.
- Compare the actual measurement curve with the reflow oven curve requirements to ensure compliance.
Matters Needing Attention
- Temperature settings for each zone are reference points and should be adjusted based on specific reflow oven conditions and solder paste models.
- For continuous production of the same product, measure the furnace temperature curve once per shift and avoid casual changes in temperature settings.
