When consulting with numerous customers, one of the common inquiries is about the quality of SMT patching and the pass-through rate. Essentially, these questions all point to quality issues, so the focus should be on ensuring efficient and effective patching. This involves considering both the human and machine factors. The human aspect includes engineers, technicians, and operators, while the machine aspect consists of the SMT placement machines. It’s important to take into account the production line requirements for placement machines. So, what kind of placement machines can meet these production line requirements? Let’s discuss that in detail in the following article.

Component Placement Accuracy:

High-precision placement accuracy and pick-up speed in SMT placement are essential to ensure precise placement of components and PCB circuit boards. Z-axis control accuracy is crucial in preventing damage to components and PCB circuit boards, as well as enhancing production efficiency.

Appropriate Pressure:

The pressure applied during patching plays a critical role in the quality of the patch. Insufficient pressure can cause smaller components’ soldering ends or pins to float on the solder paste, resulting in incomplete attachment and potential device failures. Excessive pressure can lead to solder paste stick formation and damage to the component structure.

Mounting Rate:

Different placement machines require specific adjustments to their parameters. Failure to make these adjustments in a timely manner can result in poor component placement performance. Additionally, issues with feeders and suction nozzles may cause components to fall during the placement process.